From functional ink to device layer
Printed electronics requires coating methods that match ink rheology, substrate format, target thickness and desired scale. No single technique is optimal for every development stage.
Deposit conductive inks, electrodes and functional layers with controlled spin, blade or slot-die processes.
Printed electronics requires coating methods that match ink rheology, substrate format, target thickness and desired scale. No single technique is optimal for every development stage.
Controlled motion, temperature, flow and recipes help research teams compare materials and transfer knowledge between small-area and scalable coating methods.
Spin, blade and slot-die coating are used depending on material, substrate, target layer and required production scale.
Blade and slot-die methods can process flexible substrates when the equipment configuration and substrate handling are appropriate.
Share your material, substrate and target scale. AutoCoat will help define the most suitable equipment and configuration.
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